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Accelerate Your Sample Preparation

Introducing ZEISS LaserSEM

Sample preparation on conventional milling technology e.g., focused ion beam, FIB-SEM systems is often time consuming and can reduce your overall research productivity.

What if there is a technology integration that enables you to greatly reduce the time it takes to prepare large volume samples.

ZEISS LaserSEM is your dedicated tool for large volume sample preparation. By integrating a rapid, athermal femtosecond (fs) laser to a high-resolution field emission (FE-)SEM, sample preparation workflows can be accelerated.

Benefit from:

  • Increased Productivity
  • Faster Sample Preparation
  • Accelerated Workflows

Attend the Free Webinar and Learn

  • How ZEISS LaserSEM and its integrated fs laser accelerates the speed of your sample preparation and enhances the productivity of your research facility
  • How rapid removal of massive material volumes for the preparation of massive cross-sections is enabled
  • How the ZEISS LaserSEM can be used as a pre-preparation step for TEM chunks or APT pillars in a dedicated laser chamber, while ensuring the cleanliness of your SEM chamber
  • How to perform subsurface, site-specific sample preparation such as correlative microscopy workflows, EDS or EBSD analysis, or large area serial sectioning

  • Increased Productivity:

    Faster Sample Preparation
    • There are various ion beam technologies used for sample preparation, but their milling rates limit large material removal and overall efficiency.
    • The LaserSEM, equipped with an integrated fs laser, enhances milling efficiency, speeding up the sample preparation process. This allows you to increase research productivity by preparing more samples for thorough analysis.

  • The comparison of material milling rates on silicon substrate shows you that the femtosecond laser is ~ 1000 times faster than a plasma beam for massive material removal.

  • Find out how long it will take to ablate volumes of up to 1 cubic millimeter with typical ablation rates for green fs-laser, gallium and xenon ion and plasma beams. The illustration shows the technological productivity in sample preparation.

  • When it comes to whole sample arrays an increase in productivity is even more advantageous for your research lab. Compare how material removal takes only minutes with fs laser and might take days or weeks with other beams.

Faster Sample Preparation:

Site Specific, Large Volume Sample Preparation

Benefit from fs-laser technology incorporated into your FE-SEM.

  • Accelerate your sample array e.g., multiple TEM chunks or APT pillar preparation with ZEISS LaserSEM before FIB polishing or shaping.
  • Create large cross-sections and directly acquire EDS and EBSD maps on areas of a size up to 1 mm × 1 mm.
  • Perform laser milling work in a dedicated integrated chamber to maintain cleanliness of your chamber and detectors.
  • Rapidly remove large volumes of material and get access to deeply buried structures easily.

  • ZEISS Correlative Microscopy Ecosystem for Multiscale & Multimodal Subsurface Sample Preparation and Analysis

  • Correlative Microscopy at its best: The Sample-In-Volume Analysis Workflow from ZEISS enables you to identify, access, prepare and analyze your samples with precise navigational guidance.

Accelerated Workflows:

Easily Perform Correlative, Multi-Modal, or Multi-Scale Experiments

Speed up all your workflows, no matter if you aim to prepare sample arrays or perform a correlative or a multi-scale experiment.

  • The Sample-In-Volume Analysis Workflow from ZEISS enables you to identify, access, prepare and analyze your samples with precise navigational guidance.
  • Determine buried regions of interest with a ZEISS X-ray microscope (XRM) and perform targeted sample preparation and analysis e.g. with a ZEISS LaserSEM.
  • Or include a FIB-SEM to enable a comprehensive multiscale, multimodal set up.

Why Choose ZEISS LaserSEM?

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1) Large Array and Cross-Section Sample Preparation

The ZEISS LaserSEM’s integrated fs laser is capable of removing materials 1,000 times faster than conventional milling technology. It has removal rates of up to 15 million µm³/s* (Si). This enables milling of large trenches or cross-sections and significantly increases your productivity in large array or cross-section sample preparation.

2) Contamination-Free Environment

While preparing for large array samples with massive material removal, the integrated laser chamber outside of the FE-SEM chamber ensures that the main chamber and detectors remained uncontaminated, maintaining imaging & analysis quality.

3) Advanced Site-specific Sample Preparation & Analysis

Perform targeted site-specific subsurface sample preparation and analyses with techniques such as EDS, EBSD and large area serial sectioning at your specified region of interest.

4) Accelerated Correlative Microscopy Workflow

Benefit from a seamless and rapid correlative microscopy workflow, allowing for multiscale and multimodal experiments between X-ray microscopy (XRM) and LaserSEM

5) Future-Ready

With possible future upgrades to incorporate a FIB column, the ZEISS LaserSEM ensures that your investment remains valuable and up-to-date with advancing technologies.

Want to learn more about ZEISS LaserSEM technology?

Register for the free webinar.

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